According to a new comprehensive report from The Insight Partners, the rising consumer electronics industry is a significant driver for the global 3D stacking market. As consumers seek smaller and more portable electronic devices, the need for compact and efficient power sources, such as memories, has significantly grown. Furthermore, the proliferation of IoT and smart devices is another crucial factor propelling the 3D stacking market.

3D Stacking Market Size Worth $5.94 Billion, Globally, by 2031 – Exclusive Report by The Insight Par

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Overview of Report Findings:

Market Growth: The 3D Stacking Market share is expected to reach US$ 5.94 billion by 2031 from US$ 1.81 billion in 2023, at a CAGR of 16.0% during the forecast period.

Increasing Use of Heterogeneous Integration and Component Optimization: The increasing use of heterogeneous integration and component optimization to improve the manufacturing of electronic components is a major factor driving the global 3D stacking market. This approach allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy-efficient. 3D stacking technology allows heterogeneous integration by allowing circuit layers to be created using various methods and wafer types.

Demand for High-Bandwidth Memory: High-bandwidth memory (HBM) utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor.