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Overview of Report Findings:
Market Growth: The 3D Stacking Market share is expected to reach US$ 5.94 billion by 2031 from US$ 1.81 billion in 2023, at a CAGR of 16.0% during the forecast period.
Increasing Use of Heterogeneous Integration and Component Optimization: The increasing use of heterogeneous integration and component optimization to improve the manufacturing of electronic components is a major factor driving the global 3D stacking market. This approach allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy-efficient. 3D stacking technology allows heterogeneous integration by allowing circuit layers to be created using various methods and wafer types.
Demand for High-Bandwidth Memory: High-bandwidth memory (HBM) utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor.
3D Stacking Market